Hilender
Fully Automatic Dual Lens Bonder
Hilender is a Standard Equipment for the Lens and Die Attach segment primarily serve the high mix, low volume production segment of Optical Transceiver market.
Hilender supports the following bonding processes:
- Bonding Die (VCSEL and PIN) with Silver-filled Epoxy Process
- Bonding a Lens with UV Curable Adhesive Process
- Bonding Edge Emitting Laser Die with a AuSn Eutectic Process
Features
- Supports ±0.3µm @ 3s placement accuracy
- Supports all die attach and flip-chip applications including all AFCPlus capabilities
- Higher-resolution alignment optics
- Active vibration damping system
- Automatic placement offset tuning system
- High-resolution 300mm banding station
- Dynamic alignment system
- Quantitative parallelism calibration
Custom Peripheral Options
Additional Key Features, Options and Capabilities
- Heated Bond Tool
- Pulse Heater
- Substrate Magazine Loader
Additional Modular Processes (Optional)
- Loading
- Bonding
- Height Scanner
- Quality Traceability
- UV Cure
- Handling/Conveyance
- Active Aligner
- Substrate Support
- Vision/Optical
- Vision Alignment
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