Hilender is a Standard Equipment for the Lens and Die Attach segment primarily serve the high mix, low volume production segment of Optical Transceiver
market.
Hilender supports the following bonding processes:
Bonding Die (VCSEL and PIN) with Silver-filled Epoxy Process
Bonding a Lens with UV Curable Adhesive Process
Bonding Edge Emitting Laser Die with a AuSn Eutectic Process
Features
Supports ±0.3µm @ 3s placement accuracy
Supports all die attach and flip-chip applications including all AFCPlus capabilities