COMPLETE SOLUTION
Ideation Stage
• Concept Development
• 3D Design Environment
• Prototype Systems
• Finite Element Analysis
• Vision System Integration
Development Stage
• Rapid Prototyping
• Process development & process production transfer
• Sampling and small volume production
Analysis and QC Stage
• Customized Software development
• Customized machine controls
• Process vision systems
• Image processing systems
Completion
• Continuous Process Improvement (CPI)
• On-site Engineer Support around the clock
• Service maintenance
KEY MODULE PROCESS OF OPTICAL TRANSCEIVER BONDERS
Active/Dynamic Height scan
Touch sensor using linear encoder to accurately measure the amount of bonding over travel. This helps to compensate for bonding height variation due to material.
Active/Dynamic product Alignment
High resolution camera activated during placemen of lens or die. This allow the use of vision systems for close loop placement.
Our Range of Optical Transceiver Bonders
Hilender
Fully Automatic Dual Lens Bonder
Supports ±10µm placement accuracy
Supports Lens bonding for Tx and Rx Lens applications including
- High-resolution alignment optics
- Dynamic alignment system
- 9 point calibration for multi-level
MDA
High Mix Low Volume Semi-Automatic Die & Lens Bonder
- Accuracy down to ±5µm cycle-times down to 30 sec UV cure process
- Eutectic pulse heating soldering or epoxy bonding
- Handle array die
- Closed touch sensing loop bond force control
- Supports all dispensing technologies
- Others: post-bond inspection, heated tools, etc.
NXP
MEIS Hi-speed Substrate inspection
- Bonding Die (VCSEL and PIN) with Silver-filled Epoxy Process
- Bonding a Lens with UV Curable Adhesive Process
- Bonding Edge Emitting Laser Die with a AuSn Eutectic Process
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